Hybrid circuits & Wire bond assemblies

Eurotronics offers a wide range of services in the production of complex substrates in thick-film technology as well as microelectronic (wire bond) assembly on ceramics or conventional PCBs for amongst others research & development, medical and demanding industrial applications.

Thick & thin film technology, performed by our partner production facility in Germany, is a highly sophisticated technology for the production of wiring supports that has been in use for decades. The conductor tracks are being applied by screen printing and then burned in. Ceramic substrates provide the advantage of excellent thermal conductivity, mechanical properties and service life. 

Printed resistors with a wide spectrum of electrical values from Mega Ohms (mΩ) up to Giga Ohms (gΩ), can be realized directly on the substrate with tight tolerances by means of laser trimming. Active trimming provides the possibility to adjust the electrical output signals of a circuit during operation in real-life scenario.